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Reports (Research Report) Year : 2005

An Analytical Model of Temperature in Microprocessors


Temperature has become an important design constraint for high-performance microprocessors. Research on temperature-constrained microarchitecture requires an efficient modeling of temperature. We propose an analytical model of temperature, based on solving a boundary-value problem of heat conduction. The model gives steady-state and transient temperature at any point on the dissipating plane, assuming rectangle-shaped surface sources. The model can be used to reason about temperature. It can also be implemented in a performance/power microarchitecture simulator. We provide two examples illustrating these uses.
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inria-00070275 , version 1 (19-05-2006)


  • HAL Id : inria-00070275 , version 1


Pierre Michaud, Yiannakis Sazeides, André Seznec, Theofanis Constantinou, Damien Fetis. An Analytical Model of Temperature in Microprocessors. [Research Report] RR-5744, INRIA. 2005, pp.32. ⟨inria-00070275⟩
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