Resilient Scheduling of Moldable Parallel Jobs to Cope with Silent Errors - Inria - Institut national de recherche en sciences et technologies du numérique
Article Dans Une Revue IEEE Transactions on Computers Année : 2021

Resilient Scheduling of Moldable Parallel Jobs to Cope with Silent Errors

Résumé

We study the resilient scheduling of moldable parallel jobs on high-performance computing (HPC) platforms. Moldable jobs allow for choosing a processor allocation before execution, and their execution time obeys various speedup models. The objective is to minimize the overall completion time of the jobs, or the makespan, when jobs can fail due to silent errors and hence may need to be re-executed after each failure until successful completion. Our work generalizes the classical scheduling framework for failure-free jobs. To cope with silent errors, we introduce two resilient scheduling algorithms, LPA-List and Batch-List, both of which use the List strategy to schedule the jobs. Without knowing a priori how many times each job will fail, LPA-List relies on a local strategy to allocate processors to the jobs, while Batch-List schedules the jobs in batches and allows only a restricted number of failures per job in each batch. We prove new approximation ratios for the two algorithms under several prominent speedup models (e.g., roofline, communication, Amdahl, power, monotonic, and a mixed model). An extensive set of simulations is conducted to evaluate different variants of the two algorithms, and the results show that they consistently outperform some baseline heuristics. Overall, our best algorithm is within a factor of 1.6 of a lower bound on average over the entire set of experiments, and within a factor of 4.2 in the worst case.
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Dates et versions

hal-03509760 , version 1 (04-01-2022)

Identifiants

Citer

Anne Benoit, Valentin Le Fèvre, Lucas Perotin, Padma Raghavan, Yves Robert, et al.. Resilient Scheduling of Moldable Parallel Jobs to Cope with Silent Errors. IEEE Transactions on Computers, 2021, pp.1-14. ⟨10.1109/TC.2021.3104747⟩. ⟨hal-03509760⟩
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