<?xml version="1.0" encoding="utf-8"?>
<TEI xmlns="http://www.tei-c.org/ns/1.0" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:hal="http://hal.archives-ouvertes.fr/" xmlns:gml="http://www.opengis.net/gml/3.3/" xmlns:gmlce="http://www.opengis.net/gml/3.3/ce" version="1.1" xsi:schemaLocation="http://www.tei-c.org/ns/1.0 http://api.archives-ouvertes.fr/documents/aofr-sword.xsd">
  <teiHeader>
    <fileDesc>
      <titleStmt>
        <title>HAL TEI export of hal-03520386</title>
      </titleStmt>
      <publicationStmt>
        <distributor>CCSD</distributor>
        <availability status="restricted">
          <licence target="https://creativecommons.org/publicdomain/zero/1.0/">CC0 1.0 - Universal</licence>
        </availability>
        <date when="2026-05-16T20:03:40+02:00"/>
      </publicationStmt>
      <sourceDesc>
        <p part="N">HAL API Platform</p>
      </sourceDesc>
    </fileDesc>
  </teiHeader>
  <text>
    <body>
      <listBibl>
        <biblFull>
          <titleStmt>
            <title xml:lang="en">Development of a Low-Cost, High Accuracy, Flexible Panel Indexing Cell with Modular, Elastic Architecture</title>
            <author role="aut">
              <persName>
                <forename type="first">Robert</forename>
                <surname>Brownbill</surname>
              </persName>
              <email type="md5">ccae726fb136b401415ec61d1d37b617</email>
              <email type="domain">electroimpact.com</email>
              <idno type="idhal" notation="numeric">1122640</idno>
              <idno type="halauthorid" notation="string">2396557-1122640</idno>
              <affiliation ref="#struct-1084530"/>
            </author>
            <author role="aut">
              <persName>
                <forename type="first">Adam</forename>
                <surname>Roberts</surname>
              </persName>
              <email type="md5">eca42cdd5001a5e60774f4546c901fa5</email>
              <email type="domain">electroimpact.com</email>
              <idno type="idhal" notation="numeric">1122641</idno>
              <idno type="halauthorid" notation="string">1323868-1122641</idno>
              <affiliation ref="#struct-1084530"/>
            </author>
            <editor role="depositor">
              <persName>
                <forename>Hal</forename>
                <surname>Ifip</surname>
              </persName>
              <email type="md5">2073ac78024b6e13f2714db96e9b1e63</email>
              <email type="domain">inria.fr</email>
            </editor>
          </titleStmt>
          <editionStmt>
            <edition n="v1" type="current">
              <date type="whenSubmitted">2022-01-11 08:33:59</date>
              <date type="whenModified">2022-01-11 08:56:25</date>
              <date type="whenReleased">2022-01-11 08:56:25</date>
              <date type="whenProduced">2020-12-14</date>
              <date type="whenEndEmbargoed">2024-01-01</date>
              <ref type="file" target="https://inria.hal.science/hal-03520386v1/document">
                <date notBefore="2024-01-01"/>
              </ref>
              <ref type="file" subtype="author" n="1" target="https://inria.hal.science/hal-03520386v1/file/509926_1_En_12_Chapter.pdf" id="file-3520386-3082411">
                <date notBefore="2024-01-01"/>
              </ref>
              <ref type="externalLink" target="https://link.springer.com/content/pdf/10.1007%2F978-3-030-72632-4_12.pdf"/>
            </edition>
            <respStmt>
              <resp>contributor</resp>
              <name key="200187">
                <persName>
                  <forename>Hal</forename>
                  <surname>Ifip</surname>
                </persName>
                <email type="md5">2073ac78024b6e13f2714db96e9b1e63</email>
                <email type="domain">inria.fr</email>
              </name>
            </respStmt>
          </editionStmt>
          <publicationStmt>
            <distributor>CCSD</distributor>
            <idno type="halId">hal-03520386</idno>
            <idno type="halUri">https://inria.hal.science/hal-03520386</idno>
            <idno type="halBibtex">brownbill:hal-03520386</idno>
            <idno type="halRefHtml">&lt;i&gt;9th International Precision Assembly Seminar (IPAS)&lt;/i&gt;, Dec 2020, Held virtually, Unknown Region. pp.168-183, &lt;a target="_blank" href="https://dx.doi.org/10.1007/978-3-030-72632-4_12"&gt;&amp;#x27E8;10.1007/978-3-030-72632-4_12&amp;#x27E9;&lt;/a&gt;</idno>
            <idno type="halRef">9th International Precision Assembly Seminar (IPAS), Dec 2020, Held virtually, Unknown Region. pp.168-183, &amp;#x27E8;10.1007/978-3-030-72632-4_12&amp;#x27E9;</idno>
            <availability status="restricted">
              <licence target="https://creativecommons.org/licenses/by/4.0/">CC BY 4.0 - Attribution<ref corresp="#file-3520386-3082411"/></licence>
            </availability>
          </publicationStmt>
          <seriesStmt>
            <idno type="stamp" n="IFIP">IFIP - International Federation for Information Processing</idno>
            <idno type="stamp" n="IFIP-AICT" corresp="IFIP">IFIP Advances in Information and Communication Technology</idno>
            <idno type="stamp" n="IFIP-TC" corresp="IFIP">IFIP Technical Committees </idno>
            <idno type="stamp" n="IFIP-TC5" corresp="IFIP-TC">IFIP TC5: Information Technology Applications</idno>
            <idno type="stamp" n="IFIP-WG" corresp="IFIP">Working Groups</idno>
            <idno type="stamp" n="IFIP-WG5-5" corresp="IFIP-WG">IFIP-WG5-5: Cooperation Infrastructure for Virtual Enterprises and Electronic Business (COVE)</idno>
            <idno type="stamp" n="IFIP-IPAS" corresp="IFIP">IPAS: International Precision Assembly Seminar</idno>
            <idno type="stamp" n="IFIP-AICT-620" corresp="IFIP-AICT">Smart Technologies for Precision Assembly</idno>
          </seriesStmt>
          <notesStmt>
            <note type="commentary">Part 4: Assembly Cells and Systems</note>
            <note type="audience" n="2">International</note>
            <note type="invited" n="0">No</note>
            <note type="popular" n="0">No</note>
            <note type="peer" n="1">Yes</note>
            <note type="proceedings" n="1">Yes</note>
          </notesStmt>
          <sourceDesc>
            <biblStruct>
              <analytic>
                <title xml:lang="en">Development of a Low-Cost, High Accuracy, Flexible Panel Indexing Cell with Modular, Elastic Architecture</title>
                <author role="aut">
                  <persName>
                    <forename type="first">Robert</forename>
                    <surname>Brownbill</surname>
                  </persName>
                  <email type="md5">ccae726fb136b401415ec61d1d37b617</email>
                  <email type="domain">electroimpact.com</email>
                  <idno type="idhal" notation="numeric">1122640</idno>
                  <idno type="halauthorid" notation="string">2396557-1122640</idno>
                  <affiliation ref="#struct-1084530"/>
                </author>
                <author role="aut">
                  <persName>
                    <forename type="first">Adam</forename>
                    <surname>Roberts</surname>
                  </persName>
                  <email type="md5">eca42cdd5001a5e60774f4546c901fa5</email>
                  <email type="domain">electroimpact.com</email>
                  <idno type="idhal" notation="numeric">1122641</idno>
                  <idno type="halauthorid" notation="string">1323868-1122641</idno>
                  <affiliation ref="#struct-1084530"/>
                </author>
              </analytic>
              <monogr>
                <title level="m">IFIP Advances in Information and Communication Technology</title>
                <meeting>
                  <title>9th International Precision Assembly Seminar (IPAS)</title>
                  <date type="start">2020-12-14</date>
                  <date type="end">2020-12-15</date>
                  <settlement>Held virtually</settlement>
                  <country key="ZZ">Unknown Region</country>
                </meeting>
                <editor>Svetan Ratchev</editor>
                <imprint>
                  <publisher>Springer International Publishing</publisher>
                  <biblScope unit="serie">Smart Technologies for Precision Assembly</biblScope>
                  <biblScope unit="volume">AICT-620</biblScope>
                  <biblScope unit="pp">168-183</biblScope>
                  <date type="datePub">2021</date>
                </imprint>
              </monogr>
              <idno type="doi">10.1007/978-3-030-72632-4_12</idno>
            </biblStruct>
          </sourceDesc>
          <profileDesc>
            <langUsage>
              <language ident="en">English</language>
            </langUsage>
            <textClass>
              <keywords scheme="author">
                <term xml:lang="en">Reconfigurable tooling</term>
                <term xml:lang="en">Aerospace panel indexing</term>
                <term xml:lang="en">Modular architecture</term>
                <term xml:lang="en">Flexible manufacturing</term>
              </keywords>
              <classCode scheme="halDomain" n="info">Computer Science [cs]</classCode>
              <classCode scheme="halTypology" n="COMM">Conference papers</classCode>
              <classCode scheme="halOldTypology" n="COMM">Conference papers</classCode>
              <classCode scheme="halTreeTypology" n="COMM">Conference papers</classCode>
            </textClass>
            <abstract xml:lang="en">
              <p>The global aerospace industry is driving a demand for flexible manufacturing systems to accommodate multiple programs with variable capacities within a modular, economical production cell [1]. Traditional manufacturing cells often involve bespoke, monolithic hardware limited to single program use. This inherent restraint results in significant incurred costs and program disruption when reacting to design and capacity changes. This paper describes the development of a reconfigurable panel-indexing cell with a dynamic cost architecture as an alternative approach to established, monolithic tooling structures.</p>
            </abstract>
            <particDesc>
              <org type="consortium">TC 5</org>
              <org type="consortium">WG 5.5</org>
            </particDesc>
          </profileDesc>
        </biblFull>
      </listBibl>
    </body>
    <back>
      <listOrg type="structures">
        <org type="institution" xml:id="struct-1084530" status="VALID">
          <orgName>Electroimpact UK Ltd</orgName>
          <desc>
            <address>
              <addrLine>Electroimpact Technology Park, Manor Lane, Deeside CH5 3ST, Royaume-Uni</addrLine>
              <country key="GB"/>
            </address>
            <ref type="url">https://www.electroimpact.com/</ref>
          </desc>
        </org>
      </listOrg>
    </back>
  </text>
</TEI>