<?xml version="1.0" encoding="utf-8"?>
<TEI xmlns="http://www.tei-c.org/ns/1.0" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:hal="http://hal.archives-ouvertes.fr/" xmlns:gml="http://www.opengis.net/gml/3.3/" xmlns:gmlce="http://www.opengis.net/gml/3.3/ce" version="1.1" xsi:schemaLocation="http://www.tei-c.org/ns/1.0 http://api.archives-ouvertes.fr/documents/aofr-sword.xsd">
  <teiHeader>
    <fileDesc>
      <titleStmt>
        <title>HAL TEI export of hal-01363895</title>
      </titleStmt>
      <publicationStmt>
        <distributor>CCSD</distributor>
        <availability status="restricted">
          <licence target="https://creativecommons.org/publicdomain/zero/1.0/">CC0 1.0 - Universal</licence>
        </availability>
        <date when="2026-05-14T09:48:34+02:00"/>
      </publicationStmt>
      <sourceDesc>
        <p part="N">HAL API Platform</p>
      </sourceDesc>
    </fileDesc>
  </teiHeader>
  <text>
    <body>
      <listBibl>
        <biblFull>
          <titleStmt>
            <title xml:lang="en">Characterisation of High Accuracy, Feedback Controlled, Adhesive Bonding</title>
            <author role="aut">
              <persName>
                <forename type="first">Rik</forename>
                <surname>Lafeber</surname>
              </persName>
              <idno type="halauthorid">1057644-0</idno>
              <affiliation ref="#struct-362517"/>
            </author>
            <author role="aut">
              <persName>
                <forename type="first">Gerrit</forename>
                <forename type="middle">van Den</forename>
                <surname>Bosch</surname>
              </persName>
              <idno type="halauthorid">1057645-0</idno>
              <affiliation ref="#struct-362517"/>
            </author>
            <author role="aut">
              <persName>
                <forename type="first">Max</forename>
                <surname>Murre</surname>
              </persName>
              <idno type="halauthorid">1057646-0</idno>
              <affiliation ref="#struct-362517"/>
            </author>
            <author role="aut">
              <persName>
                <forename type="first">Jitze</forename>
                <surname>Bassa</surname>
              </persName>
              <idno type="halauthorid">1057647-0</idno>
              <affiliation ref="#struct-362517"/>
            </author>
            <author role="aut">
              <persName>
                <forename type="first">Leo</forename>
                <forename type="middle">Van</forename>
                <surname>Moergestel</surname>
              </persName>
              <idno type="halauthorid">1057648-0</idno>
              <affiliation ref="#struct-362517"/>
            </author>
            <author role="aut">
              <persName>
                <forename type="first">Erik</forename>
                <surname>Puik</surname>
              </persName>
              <email type="md5">e4783b8cbcb99291dba956af0b6a0864</email>
              <email type="domain">hu.nl</email>
              <idno type="idhal" notation="numeric">988773</idno>
              <idno type="halauthorid" notation="string">853799-988773</idno>
              <affiliation ref="#struct-362517"/>
            </author>
            <editor role="depositor">
              <persName>
                <forename>Hal</forename>
                <surname>Ifip</surname>
              </persName>
              <email type="md5">2073ac78024b6e13f2714db96e9b1e63</email>
              <email type="domain">inria.fr</email>
            </editor>
          </titleStmt>
          <editionStmt>
            <edition n="v1" type="current">
              <date type="whenSubmitted">2016-09-12 10:07:03</date>
              <date type="whenModified">2016-09-12 14:22:50</date>
              <date type="whenReleased">2016-09-12 14:22:50</date>
              <date type="whenProduced">2012-02-12</date>
              <date type="whenEndEmbargoed">2015-01-01</date>
              <ref type="file" target="https://inria.hal.science/hal-01363895v1/document">
                <date notBefore="2015-01-01"/>
              </ref>
              <ref type="file" subtype="author" n="1" target="https://inria.hal.science/hal-01363895v1/file/978-3-642-28163-1_18_Chapter.pdf" id="file-1363895-1445311">
                <date notBefore="2015-01-01"/>
              </ref>
              <ref type="externalLink" target="https://link.springer.com/content/pdf/10.1007%2F978-3-642-28163-1_18.pdf"/>
            </edition>
            <respStmt>
              <resp>contributor</resp>
              <name key="200187">
                <persName>
                  <forename>Hal</forename>
                  <surname>Ifip</surname>
                </persName>
                <email type="md5">2073ac78024b6e13f2714db96e9b1e63</email>
                <email type="domain">inria.fr</email>
              </name>
            </respStmt>
          </editionStmt>
          <publicationStmt>
            <distributor>CCSD</distributor>
            <idno type="halId">hal-01363895</idno>
            <idno type="halUri">https://inria.hal.science/hal-01363895</idno>
            <idno type="halBibtex">lafeber:hal-01363895</idno>
            <idno type="halRefHtml">&lt;i&gt;6th International Precision Assembly Seminar (IPAS)&lt;/i&gt;, Feb 2012, Chamonix, France. pp.144-153, &lt;a target="_blank" href="https://dx.doi.org/10.1007/978-3-642-28163-1_18"&gt;&amp;#x27E8;10.1007/978-3-642-28163-1_18&amp;#x27E9;&lt;/a&gt;</idno>
            <idno type="halRef">6th International Precision Assembly Seminar (IPAS), Feb 2012, Chamonix, France. pp.144-153, &amp;#x27E8;10.1007/978-3-642-28163-1_18&amp;#x27E9;</idno>
            <availability status="restricted">
              <licence target="https://creativecommons.org/licenses/by/4.0/">CC BY 4.0 - Attribution<ref corresp="#file-1363895-1445311"/></licence>
            </availability>
          </publicationStmt>
          <seriesStmt>
            <idno type="stamp" n="IFIP">IFIP - International Federation for Information Processing</idno>
            <idno type="stamp" n="IFIP-AICT" corresp="IFIP">IFIP Advances in Information and Communication Technology</idno>
            <idno type="stamp" n="IFIP-TC" corresp="IFIP">IFIP Technical Committees </idno>
            <idno type="stamp" n="IFIP-TC5" corresp="IFIP-TC">IFIP TC5: Information Technology Applications</idno>
            <idno type="stamp" n="IFIP-WG" corresp="IFIP">Working Groups</idno>
            <idno type="stamp" n="IFIP-WG5-5" corresp="IFIP-WG">IFIP-WG5-5: Cooperation Infrastructure for Virtual Enterprises and Electronic Business (COVE)</idno>
            <idno type="stamp" n="IFIP-IPAS" corresp="IFIP">IPAS: International Precision Assembly Seminar</idno>
            <idno type="stamp" n="IFIP-AICT-371" corresp="IFIP-AICT">Precision Assembly Technologies and Systems (IPAS 2012)</idno>
          </seriesStmt>
          <notesStmt>
            <note type="commentary">Part 4: Metrology and Quality Control</note>
            <note type="audience" n="2">International</note>
            <note type="invited" n="0">No</note>
            <note type="popular" n="0">No</note>
            <note type="peer" n="1">Yes</note>
            <note type="proceedings" n="1">Yes</note>
          </notesStmt>
          <sourceDesc>
            <biblStruct>
              <analytic>
                <title xml:lang="en">Characterisation of High Accuracy, Feedback Controlled, Adhesive Bonding</title>
                <author role="aut">
                  <persName>
                    <forename type="first">Rik</forename>
                    <surname>Lafeber</surname>
                  </persName>
                  <idno type="halauthorid">1057644-0</idno>
                  <affiliation ref="#struct-362517"/>
                </author>
                <author role="aut">
                  <persName>
                    <forename type="first">Gerrit</forename>
                    <forename type="middle">van Den</forename>
                    <surname>Bosch</surname>
                  </persName>
                  <idno type="halauthorid">1057645-0</idno>
                  <affiliation ref="#struct-362517"/>
                </author>
                <author role="aut">
                  <persName>
                    <forename type="first">Max</forename>
                    <surname>Murre</surname>
                  </persName>
                  <idno type="halauthorid">1057646-0</idno>
                  <affiliation ref="#struct-362517"/>
                </author>
                <author role="aut">
                  <persName>
                    <forename type="first">Jitze</forename>
                    <surname>Bassa</surname>
                  </persName>
                  <idno type="halauthorid">1057647-0</idno>
                  <affiliation ref="#struct-362517"/>
                </author>
                <author role="aut">
                  <persName>
                    <forename type="first">Leo</forename>
                    <forename type="middle">Van</forename>
                    <surname>Moergestel</surname>
                  </persName>
                  <idno type="halauthorid">1057648-0</idno>
                  <affiliation ref="#struct-362517"/>
                </author>
                <author role="aut">
                  <persName>
                    <forename type="first">Erik</forename>
                    <surname>Puik</surname>
                  </persName>
                  <email type="md5">e4783b8cbcb99291dba956af0b6a0864</email>
                  <email type="domain">hu.nl</email>
                  <idno type="idhal" notation="numeric">988773</idno>
                  <idno type="halauthorid" notation="string">853799-988773</idno>
                  <affiliation ref="#struct-362517"/>
                </author>
              </analytic>
              <monogr>
                <title level="m">IFIP Advances in Information and Communication Technology</title>
                <meeting>
                  <title>6th International Precision Assembly Seminar (IPAS)</title>
                  <date type="start">2012-02-12</date>
                  <date type="end">2012-02-15</date>
                  <settlement>Chamonix</settlement>
                  <country key="FR">France</country>
                </meeting>
                <editor>Svetan Ratchev</editor>
                <imprint>
                  <publisher>Springer</publisher>
                  <biblScope unit="serie">Precision Assembly Technologies and Systems</biblScope>
                  <biblScope unit="volume">AICT-371</biblScope>
                  <biblScope unit="pp">144-153</biblScope>
                  <date type="datePub">2012</date>
                </imprint>
              </monogr>
              <idno type="doi">10.1007/978-3-642-28163-1_18</idno>
            </biblStruct>
          </sourceDesc>
          <profileDesc>
            <langUsage>
              <language ident="en">English</language>
            </langUsage>
            <textClass>
              <keywords scheme="author">
                <term xml:lang="en">curing time</term>
                <term xml:lang="en">bond volume</term>
                <term xml:lang="en">gap size</term>
                <term xml:lang="en">process parameters</term>
                <term xml:lang="en">position accuracy</term>
                <term xml:lang="en">bond stress</term>
                <term xml:lang="en">force control</term>
                <term xml:lang="en">adhesive bonding</term>
              </keywords>
              <classCode scheme="halDomain" n="info">Computer Science [cs]</classCode>
              <classCode scheme="halTypology" n="COMM">Conference papers</classCode>
              <classCode scheme="halOldTypology" n="COMM">Conference papers</classCode>
              <classCode scheme="halTreeTypology" n="COMM">Conference papers</classCode>
            </textClass>
            <abstract xml:lang="en">
              <p>Adhesive bonding for industrial purposes has, over the last years, become more important compared to conventional joining methods, due to application in miniaturized systems where other ways of joining are too bulky. These days’ industries have to deal with the challenge of applying adhesive bonds with small tolerances, while the geometrical dimensions of the applied adhesives change due to the curing process of the bond. This effect is called ‘adhesive shrinkage’. This paper explains the effects of adhesive shrinkage, during bonding processes, on internal bond stress and the influences on position accuracy of the adherent parts. Effect of parameters like curing time, gap size between components and adhesive volume are studied. This is done by use of a test setup containing a manipulator with force sensor to simulate an industrial setup for the application of similar adhesive bonds. Results show that the gap-size has influence on shrinkage behaviour, whereas the adhesive volume, which defines the cross section area of the bond, is less important. Results can be used to develop a bonding procedure, which leads to an optimal balance between position accuracy and bond stress, thus guaranteeing a reliable and accurate bond in industrial manufacturing environments.</p>
            </abstract>
            <particDesc>
              <org type="consortium">TC 5</org>
              <org type="consortium">WG 5.5</org>
            </particDesc>
          </profileDesc>
        </biblFull>
      </listBibl>
    </body>
    <back>
      <listOrg type="structures">
        <org type="institution" xml:id="struct-362517" status="VALID">
          <idno type="ROR">https://ror.org/028z9kw20</idno>
          <orgName>University of Applied Sciences [Utrecht]</orgName>
          <orgName type="acronym">HU</orgName>
          <desc>
            <address>
              <addrLine>Padualaan 101, 3584 CH Utrecht</addrLine>
              <country key="NL"/>
            </address>
            <ref type="url">https://www.international.hu.nl</ref>
          </desc>
        </org>
      </listOrg>
    </back>
  </text>
</TEI>